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Description
English: Schematic chevron notched specimen with small stripes used for bond strength determination.
Source Ö. Vallin and K. Jonsson and U. Lindberg, Adhesion quantification methods for wafer bonding (2005)
Author Fraunhofer ENAS, D. Neumann
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Attribution: Fraunhofer ENAS
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current12:01, 10 April 2011Thumbnail for version as of 12:01, 10 April 2011607 × 431 (11 KB)Enaswiki{{Information |Description ={{en|1={{Information |Description ={{en|1=Schematic infrared transmission microscopy setup for wafer bond characterization.}} |Source ={{own}} |Author =Fraunhofer ENAS, [[User:neum.dan|D.

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